Reduce Weight, Minimize Vibration, and Consolidate Parts for Increased Reliability, Improved Manufacturing, and Yield
weight reduction in flexures
higher resonant frequency and reduced system vibration
Additive manufacturing allows for the structural optimization and light-weighting of advanced flexure designs that reduce weight and minimize vibration to meet the exacting requirements of semiconductor capital equipment. Additionally, multipart assemblies can be replaced with monolithic parts for increased reliability, improved manufacturing, and yield.
With years of application engineering experience in the semiconductor industry, we can help you optimize the structural designs of flexures, advanced motion mechanisms, and components. Additive manufacturing gives designers the flexibility to optimize the structural topology of your part (i.e., lightweighting) with a suite of high-strength metal alloys. These designs can meet the performance requirements of semiconductor capital equipment more precisely, improve the strength-to-weight ratio, and deliver a faster time to market. With our metal additive solutions, you can also avoid traditional complex manufacturing assembly by consolidating several parts into one, which improves yield and reliability and reduces labor and inspection costs.