Improve Surface Temperatures and Thermal Gradients, while Reducing Time Constraints
decrease in ΔT demonstrated (13.8 to 2.3 mK)
stabilization improvement demonstrated
Keeping temperatures within milliKelvin (mK) ranges is critical as any system disturbance has an impact at the nanometer scale. By optimizing cooling channels and surface patterns, you dramatically improve surface temperatures and thermal gradients while reducing time constants. This results in improved system speed and accuracy.
Drawing on our many years of experience in semiconductor production and applications, we can help you apply additive manufacturing to optimize the thermal management of semiconductor equipment. With unique designs attainable only with additive manufacturing, you can efficiently dissipate heat, enhance system throughput and accuracy, and improve overall performance.
Discover how to increase throughput and quality of semiconductor lithography equipment with optimized wafer table thermal management and learn more about the direct metal printing solution capable to accurately produce the most complex designs.