Improve Surface Temperatures and Thermal Gradients, while Reducing Time Constraints
83%
decrease in ΔT demonstrated (13.8 to 2.3 mK)
5x
stabilization improvement demonstrated

Optimize the Thermal Management of Semiconductor Equipment

A Lamellar heat exchanger 3d printed in Laserform 316L (B) stainless steel in the palm of a man's hand

Keeping temperatures within milliKelvin (mK) ranges is critical as any system disturbance has an impact at the nanometer scale. By optimizing cooling channels and surface patterns, you dramatically improve surface temperatures and thermal gradients while reducing time constants. This results in improved system speed and accuracy.  

Drawing on our many years of experience in semiconductor production and applications, we can help you apply additive manufacturing to optimize the thermal management of semiconductor equipment. With unique designs attainable only with additive manufacturing, you can efficiently dissipate heat, enhance system throughput and accuracy, and improve overall performance.

The Benefits of Metal Additive Manufacturing

  • Semiconductor DMP Manifold in 3DXpert

  • Design Flexibility

    Additive manufacturing makes it possible to optimally design (e.g., using topology optimization), rapidly iterate, and manufacture wafer tables with complex features, such as cooling channels, that dissipate heat better.

  • a person in protective gear holding a 3D printed part

  • High Quality and Accuracy for Clean Room Environments

    Our metal additive solutions ensure high material quality and part accuracy, producing parts in an inert atmosphere with a steady, ultra-low oxygen level—coupled with proprietary processes for optimal particle cleanliness. This results in metal parts that meet clean room requirements and are fit for use in lithography equipment.

  • wafer tables sitting on a platform

  • Performance and Productivity

    Better thermal management of critical semiconductor equipment components, such as wafer tables, can improve semiconductor equipment accuracy by 1–2 nm and simultaneously improve speed and throughput. An increased machine speed and uptime leads to more wafers processed and higher overall lifecycle value. Additive manufacturing also delivers structurally optimized wafer tables with reduced part counts and assemblies. Replacing multipart assemblies with monolithic parts increases reliability, improves manufacturing yield, and reduces labor costs.

Answer Challenges Related to Thermal Efficiency

  • thermal gradients rendered

    Reduce Thermal Gradients

    Changing temperatures and thermal gradients in wafer tables negatively affects the lithography process and system performance, causing distortion and impacting throughput and accuracy. 

  • a hand holding an hourglass

    Improve Time to Market

    Optimizing wafer tables for thermal efficiency and performance with traditional manufacturing methods typically requires multiple design iterations that can negatively affect project timelines.

  • 3 people standing in a facility discussing work

    Lower Cost and Increase Reliability

    Increasing wafer table complexity with traditional manufacturing, such as by introducing weld seams, typically results in rising part costs. This also sacrifices part performance and reliability.

More Semiconductor Applications

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Manifold Fluid Flow Optimization
semiconductor vdl focus stack flexure structural optimization image

Flexure and Structural Optimization
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3DXpert

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  • Application Innovation Group

    Our team can help you solve your most difficult design and production challenges with additive manufacturing solutions. Together we’ll identify your needs, working with you to optimize your designs, prototype, validate and define a manufacturing flow.

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