Deliver Longer Service Life of High-Speed Stages, Superior Cooling Efficiency and Performance with Monolithic, Leak-Proof, Metal 3D Printed Cooling Jackets.
8:1
part consolidation
0.6 mm
wall thickness achieved
75%
component production time reduction

Increase Cooling Efficiency of Linear Stages While Reducing Part Count

By optimizing cooling channels and cooling jackets’ walls thickness, you dramatically improve temperature stability of the fast-moving linear stage. Maintaining encoders’ scale thermal uniformity ensures positioning accuracy and longer-term stability. Combined with component consolidation, this results in improved system reliability and a reduction in heat sources.

Drawing on our many years of experience in semiconductor capital equipment applications, we can help you apply additive manufacturing to optimize thermal management. With unique designs attainable only through additive manufacturing, you can efficiently dissipate heat, enhance system throughput and accuracy, and improve overall performance.

The Benefits of Metal Additive Manufacturing

  • Semiconductor Cooler with Fluid with Cross Section

  • Design Flexibility

    Because additive manufacturing gives semiconductor equipment and thermal management engineers unprecedented design flexibility, they are able to unlock new levels of complexity for integrated cooling channels and reduce part counts and assemblies, thus maximizing the efficiency of linear stages cooling jackets and increasing their reliability for higher performance and accuracy. 

  • Semiconductor Linear Stage Cooling Clean Room Environments

  • High Quality and Accuracy for Clean Room Environments

    High material quality and part accuracy produced in an inert atmosphere with a steady, ultra-low oxygen level—coupled with proprietary processes for optimal particle cleanliness—result in metal parts that meet clean room requirements and are fit for use in semiconductor equipment. Our metal additive manufacturing solutions enable wall thicknesses as low as 0.6 mm, minimizing the thermal resistance between the cooling channels and the controlled surface.

  • Performance and Productivity

    Better thermal management and increased component reliability enable speed and uptime increases in semiconductor manufacturing equipment, ultimately leading to increased manufacturing yield with more wafers processed and higher overall lifecycle value.

Your Path to More Efficient Linear Stages Coolers

  • Semiconductor Cooler with Fluid

    Improve Cooling Efficiency

    Due to high acceleration, linear stages can generate and maintain significant thermal loads. Efficient thermal management of linear stages allows for longer service life and consistent positioning accuracy, positively impacting overall equipment throughput.

  • a technician holding a wafer

    Increased Components Reliability

    By creating monolithic cooling jackets, you are eliminating sources of leakage at weld lines. Superior cooling efficiency can be gained in less space, with no assembly required, translating to longer intervals between service and maximum tool uptime.

  • a hand holding an hourglass

    Accelerate Time-to-Market and Lower Costs

    Monolithic components dramatically reduce the number of suppliers required to accomplish an engineering project. Additive manufacturing enables rapid design iteration in the product development stage with almost static cost and lead-time, independent of the geometry.

Resources

  • Semiconductor ebook cover

    Rapidly Adopt and Scale Metal Additive Manufacturing

    In this eBook, you’ll learn how 3D Systems’ decades of experience and expertise helps integrate metal AM to drive performance, productivity, and reliability improvements for semiconductor capital equipment manufacturers and suppliers.

    Get the eBook
  • Silicon Wafers and Microcircuits sitting on a robot arm

    Additive Manufacturing for Semiconductor Capital Equipment

    Discover how 3D Systems’ metal additive manufacturing can give semiconductor capital equipment manufacturers and suppliers the capabilities they need to improve performance, productivity, and reliability.

    Read our Brochure

More Semiconductor Applications

hand holding a dmp manifold fluid flow optimization image alt

Manifold Fluid Flow Optimization
semiconductor wafer table thermal management link

Wafer Table Thermal Management
semiconductor vdl focus stack flexure structural optimization image

Flexure and Structural Optimization
Semiconductor Gas Mixer

Gas Conveyance and Mixing
A 3D printed Semiconductor Showerhead

Showerhead Optimization

Learn More About Linear Stage Coolers Manufacturing Solutions

DMP Factory 350 Duel 3D Printer

DMP Factory 350 and DMP Factory 350 Dual

Scalable, high quality metal AM with integrated powder management

Manufacture metal parts with scalable DMLS with removable build chamber for continuous printing

DMP Factory 500

Robust, high quality metal AM with integrated powder management

3D Systems 3DXpert hero image

3DXpert

All-in-One Integrated Software for Industrial Additive Manufacturing

3D Systems DMP LaserForm 316L (A) Impeller

LaserForm 316L (A)

Able to be sterilized and highly corrosion resistant.

DMP Flex 350 Duel 3D printer

DMP Flex 350, DMP Flex 350 Dual and DMP Flex 350 Triple

Robust, flexible metal 3D printer for rapid part production

Suspension Rockers made from Certified Scalmalloy (A)

Certified Scalmalloy (A)

High strength aluminum with excellent corrosion resistance

3D Systems DMP Metal LaserForm Ti Gr23 (A) titanium alloy

LaserForm Ti Gr23 (A)

High strength, low weight, excellent biocompatibility - lower Oxygen than Gr5

DMP Inspection for QA in Metal AM

DMP Inspection

Minimize secondary inspection in Metal AM with validated automated analysis

DMP Monitoring - real-time metal additive process monitoring

DMP Monitoring

Real-time process monitoring for informed decisions on product quality

LaserForm AlSi10MG Heat Exchanger

LaserForm AlSi10Mg (A)

Good mechanical properties and good thermal conductivity

Bracket for aerospace applications metal 3d printed with LaserForm AlSi7Mg0.6 (A) - design by Thales Alenia Space

LaserForm AlSi7Mg0.6 (A)

Light weight, good mechanical properties and improved thermal conductivity

3D Systems DMP LaserForm Ali12 (B) aluminium alloy AlSi12

LaserForm AlSi12 (B)

Metal powder for light weight parts with good thermal properties

a 3D rendering made from Control X software

Geomagic Control X

3D Inspection and Metrology Software

Geomagic Design X reverse engineering and 3D scanning software

Geomagic Design X

Reverse Engineering Software

Talk to an Expert

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  • Application Innovation Group

    Our team can help you solve your most difficult design and production challenges with additive manufacturing solutions. Together we’ll identify your needs, working with you to optimize your designs, prototype, validate and define a manufacturing flow.