Design and Manufacture Superior Performing Manifolds with Optimized Flow that Reduce Pressure Drop, Mechanical Disturbances, and Vibration
90%
reduction in flow-induced disturbance forces demonstrated
20+
part assembly to a single, reliable monolithic part

Optimize Flow and Reduce Pressure Drop, Mechanical Disturbances, and Vibration

3D Printed DMP Manifold on Side

With our many years of experience in semiconductor fluid and gas flow applications, we’ve helped customers optimize manifold designs for improved performance. The traditional manufacturing of complex fluid manifolds results in large, heavy parts that have abrupt fluid flow and stagnant zones and are prone to leakage. Semiconductor capital equipment, with performance specifications in the nanometer range, are influenced by the resulting pressure drops, mechanical disturbances, and vibration.  

Additive manufacturing allows for the creation of optimal fluid manifolds that reduce pressure drop, mechanical disturbances and vibration. With our metal additive solutions, you can also avoid traditional complex manufacturing assembly by consolidating several parts into one, which improves yield and reliability and reduces labor and inspection costs. 

The Benefits of Metal Additive Manufacturing

  • Design Flexibility ‘Function over Form’

    Additive manufacturing makes it possible to optimally design, rapidly iterate, and manufacture manifolds with complex freeform channels that decrease turbulence and pressure fluctuations while consolidating parts to reduce weight and space requirements.
  • Semiconductor DMP Manifold in 3DXpert
  • 3d systems laserform ti gr5 (a) dmp hydraulic manifold gf post machined alternate

  • High Quality and Accuracy for Clean Room Environments

    High material quality and part accuracy produced in an inert atmosphere with a steady, ultra-low oxygen level—coupled with proprietary processes for optimal particle cleanliness—result in metal parts that meet clean room requirements and are fit for use in semiconductor equipment.
  • a person standing next to a 3D printer

  • Performance and Productivity

    A 90% reduction in flow-induced disturbance forces reduces system vibration and realizes a 1–2 nm accuracy improvement. An increased machine speed and uptime leads to more wafers processed and higher overall lifecycle value. Additive manufacturing also delivers structurally optimized manifolds with reduced part counts and assemblies. Replacing multipart assemblies with monolithic parts increases reliability, improves manufacturing yield, and reduces labor costs.

Solve Fluid Flow Performance Issues

  • Reduce Fluid Flow Disturbances

    Semiconductor equipment depends on manifolds that must have optimally designed and manufactured fluid channels. Traditional manufacturing methods have abrupt corners and stagnant flow zones that result in turbulence and increased pressure drops. 

  • Minimize Weight and Volume

    Traditional manufacturing, based on the geometric limitations of milling and tooling, can lead to the design of manifolds with excess weight and volume, negatively affecting system performance. 

  • Eliminate Fluid Leakage at Connections

    The geometric limitations of subtractive manufacturing means that manifolds typically undergo an assembly process that requires connection points prone to failure and leakage.

Resources

  • 3D Systems Semiconductor Manifold Banner

    Optimizing Fluid Manifolds with Additive Manufacturing

    Find out how additive manufacturing resolves issues of traditionally manufactured fluid manifolds by removing assembly operations, taking out excess weight, and enabling the production of more organic shapes.

    Read the Brief
  • Semiconductor ebook cover

    Rapidly Adopt and Scale Metal Additive Manufacturing

    In this eBook, you’ll learn how 3D Systems’ decades of experience and expertise helps integrate metal AM to drive performance, productivity, and reliability improvements for semiconductor capital equipment manufacturers and suppliers.

    Get the eBook
  • Silicon Wafers and Microcircuits sitting on a robot arm

    Additive Manufacturing for Semiconductor Capital Equipment

    Discover how 3D Systems’ metal additive manufacturing can give semiconductor capital equipment manufacturers and suppliers the capabilities they need to improve performance, productivity, and reliability.

    Read our Brochure

More Semiconductor Applications

semiconductor wafer table thermal management link

Wafer Table Thermal Management
semiconductor vdl focus stack flexure structural optimization image

Flexure and Structural Optimization
Semiconductor linear stage cooler with fluid cross section showing heat and cooling

Linear Stage Cooling
A 3D printed Semiconductor Showerhead

Showerhead Optimization
Semiconductor Gas Mixer

Gas Conveyance and Mixing

Learn More About Air and Fluid Flow 3D Printers and Materials

DMP Factory 350 Duel 3D Printer

DMP Factory 350 and DMP Factory 350 Dual

Scalable, high quality metal AM with integrated powder management

DMP Flex 350 Duel 3D printer

DMP Flex 350, DMP Flex 350 Dual and DMP Flex 350 Triple

Robust, flexible metal 3D printer for rapid part production

Thales Metal Bracket LaserForm Titanium Gr. 5

LaserForm Ti Gr5 (A)

High strength, low weight, excellent biocompatibility

3D Systems 3DXpert hero image

3DXpert

All-in-One Integrated Software for Industrial Additive Manufacturing

Manufacture metal parts with scalable DMLS with removable build chamber for continuous printing

DMP Factory 500

Robust, high quality metal AM with integrated powder management

LaserForm Ni718 (A) DMP Combustion Chamber

LaserForm Ni718 (A)

Oxidation, corrosion and extremely high-temperature resistant

3D Systems Pintle Nozzle printed with LaserForm Ni626 (B)

LaserForm Ni625 (B)

Excellent corrosion resistance, high strength and heat resistance

3D Systems Laserform Ni625 Nozzle

LaserForm Ni625 (A)

Excellent corrosion resistance, high strength and heat resistance

LaserForm AlSi10MG Heat Exchanger

LaserForm AlSi10Mg (A)

Good mechanical properties and good thermal conductivity

Bracket for aerospace applications metal 3d printed with LaserForm AlSi7Mg0.6 (A) - design by Thales Alenia Space

LaserForm AlSi7Mg0.6 (A)

Light weight, good mechanical properties and improved thermal conductivity

3D Systems DMP LaserForm 316L (A) Impeller

LaserForm 316L (A)

Able to be sterilized and highly corrosion resistant.

DMP Monitoring - real-time metal additive process monitoring

DMP Monitoring

Real-time process monitoring for informed decisions on product quality

a 3D rendering made from Control X software

Geomagic Control X

3D Inspection and Metrology Software

Geomagic Design X reverse engineering and 3D scanning software

Geomagic Design X

Reverse Engineering Software

Talk to an Expert

I consent to receive 3D Systems Communications
Would you like to receive special offers, product updates, and event news from 3D Systems? By clicking "Yes", you agree to receive follow-up communications from 3D Systems or our partners. You can also choose to opt out of communications at any time. Please click here to view our Privacy Policy or click here to manage your Preferences.

  • Application Innovation Group

    Our team can help you solve your most difficult design and production challenges with additive manufacturing solutions. Together we’ll identify your needs, working with you to optimize your designs, prototype, validate and define a manufacturing flow.