Design and Manufacture Superior Performing Manifolds with Optimized Flow that Reduce Pressure Drop, Mechanical Disturbances, and Vibration
reduction in flow-induced disturbance forces demonstrated
part assembly to a single, reliable monolithic part

Optimize Flow and Reduce Pressure Drop, Mechanical Disturbances, and Vibration

The Benefits of Metal Additive Manufacturing

  • Design Flexibility ‘Function over Form’

    Additive manufacturing makes it possible to optimally design, rapidly iterate, and manufacture manifolds with complex freeform channels that decrease turbulence and pressure fluctuations while consolidating parts to reduce weight and space requirements.
  • Semiconductor DMP Manifold in 3DXpert
  • 3d systems laserform ti gr5 (a) dmp hydraulic manifold gf post machined alternate
  • High Quality and Accuracy for Clean Room Environments

    High material quality and part accuracy produced in an inert atmosphere with a steady, ultra-low oxygen level—coupled with proprietary processes for optimal particle cleanliness—result in metal parts that meet clean room requirements and are fit for use in semiconductor equipment.
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  • Performance and Productivity

    A 90% reduction in flow-induced disturbance forces reduces system vibration and realizes a 1–2 nm accuracy improvement. An increased machine speed and uptime leads to more wafers processed and higher overall lifecycle value. Additive manufacturing also delivers structurally optimized manifolds with reduced part counts and assemblies. Replacing multipart assemblies with monolithic parts increases reliability, improves manufacturing yield, and reduces labor costs.

Solve Fluid Flow Performance Issues

  • Reduce Fluid Flow Disturbances

    Semiconductor equipment depends on manifolds that must have optimally designed and manufactured fluid channels. Traditional manufacturing methods have abrupt corners and stagnant flow zones that result in turbulence and increased pressure drops. 

  • Minimize Weight and Volume

    Traditional manufacturing, based on the geometric limitations of milling and tooling, can lead to the design of manifolds with excess weight and volume, negatively affecting system performance. 

  • Eliminate Fluid Leakage at Connections

    The geometric limitations of subtractive manufacturing means that manifolds typically undergo an assembly process that requires connection points prone to failure and leakage.


  • 3D Systems Semiconductor Manifold Banner

    Optimizing Fluid Manifolds with Additive Manufacturing

    Find out how additive manufacturing resolves issues of traditionally manufactured fluid manifolds by removing assembly operations, taking out excess weight, and enabling the production of more organic shapes.

  • Semiconductor ebook cover

    Rapidly Adopt and Scale Metal Additive Manufacturing

    In this eBook, you’ll learn how 3D Systems’ decades of experience and expertise helps integrate metal AM to drive performance, productivity, and reliability improvements for semiconductor capital equipment manufacturers and suppliers.

  • Silicon Wafers and Microcircuits sitting on a robot arm

    Additive Manufacturing for Semiconductor Capital Equipment

    Discover how 3D Systems’ metal additive manufacturing can give semiconductor capital equipment manufacturers and suppliers the capabilities they need to improve performance, productivity, and reliability.

More Semiconductor Applications

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  • Application Innovation Group

    Our team can help you solve your most difficult design and production challenges with additive manufacturing solutions. Together we’ll identify your needs, working with you to optimize your designs, prototype, validate and define a manufacturing flow.