• Applications

    • Functional prototyping for components in hot environments
    • Rapid prototyping of high temperature parts and applications
    • Electronic housings/cases
    • Thermal shielding/insulation
    • Direct contact with melted solder for fixtures and manufacturing
    • High temperature molds
    • Contain and direct heated fluid and gas flows
    • Complex and fine diameter internal structures
  • Benefits

    • Highest thermal resistance in its class
    • Clear enough to visualize internal features and flow
    • High fidelity fine features and sharp edges
    • Smooth surface quality
    • UL94 HB  flammability test standards
    • USP Class VI certified for biocompatibility
  • Features

    • Heat deflection temperature at 0.45 MPa: 250°C
    • High modulus - Strong and stiff
    • Translucent material, light amber
    • Biocompatible*
    • For use with the ProJet® MJP 2500 Plus

Note: This material runs on the ProJet MJP 2500 Plus in UHD mode only.

* Biocompatibility is based on testing by an independent testing lab on a single geometry and sample set per USP Class VI. Users should confirm fitness for use and biocompatibility for their applications.


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Technical Specifications

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Printers compatible with this material: