Download Executive Brief
Read this executive brief to see how semiconductor capital equipment manufacturers can integrate metal AM into their manufacturing processes to rapidly deliver optimized precision components that maximize the performance, quality, yield, and reliability of their equipment.
With over two decades of semiconductor and additive manufacturing experience, 3D Systems will help you quickly adopt metal AM technology, giving you the control you need to produce high-performing, optimized parts.
We can help enable your AM capabilities across several key applications, such as:
- Manifold and Tubing Flow Optimization: Maximize fluid and gas flow efficiency
- Wafer Table Thermal Management: Optimize for thermal efficiency and performance
- Flexure and Structural Optimization: Improve yield with lighter, consolidated parts
Download our executive brief to learn more about the benefits of metal AM and how we can accelerate your adoption.